Break the constraints of traditional
multilayer circuit board construction!

The new high-density, low-cost alternative
to multilayer circuit boards.

Medallion Technology has developed a novel way to interconnect electronics using their patented Twisted Wired Interconnects (TWI). The method greatly improves upon traditional circuit board construction by converting complex multi-layer circuit boards to a series of simple, inexpensive, double-sided boards.

Based on your specific application, the TWI advantage can provide:

1. Reduced bare board cost
2. Significant reductions in
component and I/O circuit board densities
3. Substantial reductions in circuit
board size and area resulting in high functional densities
4. Improved thermal management
5. Improved response to shock and
vibration
6. Much greater circuit board layout flexibility
7. Simpler board-to-board interconnections using distributed individual twisted wire interconnections rather than concentrated high pin count connectors

Explore our site and access a technical paper to learn more about what many are calling the next great step in electronic product packaging.