Medallion Technology: high density interconnects, 3D interconnects, solderless interconnects, PCB interconnects

Video

Recent Events

Global SMT & Packaging Article January 2010
"Synergy, the Occam process and twisted wire interconnect"

SMTA Expo & Tech Forum
Richardson Civic Center,
Richardson, TX
Tuesday, March 2, 2010
Free Registration

SMTA Expo & Tech Forum
Stafford Centre,
Stafford, TX
Thursday, March 4, 2010
Free Registration

Update: Nearing Production
TWI-2200
Full Automated
Assembly System
Expected Introduction
Q1, 2010

Technology

 

High density interconnect tool for electronic circuit board assembly.

  • High Density
  • High Speed
  • Short Signal Path
  • Controllable Impedance
  • Maintain Signal Integrity

 

Our Product

 

We produce and supply manufacturing with TWI’s ready for use in their applications.  TWI’s are automatically loaded into cartridges during manufacturing and delivered to the end user for seamless introduction into the assembly system.

Our Systems

 

We design and produce TWI assembly equipment to fit your manufacturing volume.  From semi-automated to fully automated, we can integrate into your manufacturing environment.