Medallion Technology: high density interconnects, 3D interconnects, solderless interconnects, PCB interconnects

Video

Future Events

SEMICON West 2010
Moscone Center
San Francisco, CA
July 13-15, 2010
Booth 5675

IPC Electronics Midwest
Donald E. Stephens Convention Center
Rosemont, IL
September 28-30, 2010
Booth 7426

SMTA International Conference & Exposition
Walt Disney Swan & Dolphin Resort
Orlando, FL
October 26 & 27, 2010
Booth 428

Technology

 

High density interconnect tool for electronic circuit board assembly.

  • High Density
  • High Speed
  • Short Signal Path
  • Controllable Impedance
  • Maintain Signal Integrity

 

Our Product

 

We produce and supply manufacturing with TWI’s ready for use in their applications.  TWI’s are automatically loaded into cartridges during manufacturing and delivered to the end user for seamless introduction into the assembly system.

Our Systems

 

We design and produce TWI assembly equipment to fit your manufacturing volume.  From semi-automated to fully automated, we can integrate into your manufacturing environment.